Semiconductor

High-quality micron-sized diamond materials are essential for semiconductor wafer processing, and ILJIN provides micron-sized diamond powder whose shape, particle size, and surface condition are thoroughly controlled.
In the wafer and semiconductor fields, harder workpiece materials are being developed every year, and difficult machining and high efficiency are required. In addition, the heat-conducting properties of ultra-superhard materials are also gaining attention for the thermal management of semiconductor chips.
For a long time, we’ve been engaged in the research and manufacturing of ultra-hard materials aimed at increasing production efficiency and improving grinding performance. Based on that experience, we will present new solutions and contribute to increasing the process efficiency of users.